綠志島金屬有限公司最新推出(chu)無(wu)鉛中溫Sn/Bi/Cu合金(jin)錫膏，型號：中(zhong)溫錫(xi)膏PF-3005-C，具特性如(ru)下：

1. 熔點(dian)低（146～190℃），焊(han)接溫度接近錫(xi)鉛錫(xi)膏，對元器件和板材耐熱性要求低，生產工藝窗口大(da)；

2. 相(xiang)對于目前(qian)常用的無鉛合金錫膏（如Sn/Ag/Cu或(huo)Sn/Bi/Ag），成本低；

3. 熱(re)導(dao)(dao)性好，在散熱(re)模組(zu)產品(pin)(pin)上應用此產品(pin)(pin)，其熱(re)導(dao)(dao)率(lv)比Sn/Bi合金增高一倍左右；

4. 此合金機械(xie)強度接近Sn/Ag/Cu合金。

4. 此(ci)產品采用球形度(du)(du)好、顆(ke)粒度(du)(du)分布均勻的錫(xi)粉煉制而成，粘(zhan)度(du)(du)適中(zhong)，適應各種(zhong)涂(tu)布方(fang)法；

5. 印刷(shua)滾動性(xing)、脫膜性(xing)及抗坍(tan)塌(ta)性(xing)均表現優(you)良，可有效解決(jue)密(mi)間距和(he)小元件的焊盤印刷(shua)；

6. 潤濕性(xing)好，能適(shi)應不同(tong)的金屬(shu)鍍(du)層；焊后板面殘留極少且(qie)透明、阻抗(kang)高，焊點平(ping)滑(hua)飽滿；

7. 此(ci)款合金錫膏可作為Sn/Ag/Cu合(he)金（表面貼裝和通(tong)孔涂布工藝）及Sn/Bi（散熱(re)模組(zu)）類型(xing)產(chan)品(pin)的替代(dai)品(pin)；可有效地緩解(jie)焊料(liao)行(xing)業中(zhong)對Ag需求的劇烈增加和避免(mian)無鉛的高溫焊接；解(jie)決了Sn/Bi焊料在散熱模組(zu)產品上的低(di)熱導問題(ti)。

        Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.

附本錫膏應用案(an)例：

1、應(ying)用于散(san)熱器的焊接

2、應用于表面貼裝